Softworld, Inc. MSP Fulfillment
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Job Description:
· Directs Microsystem Electrical Team day-to-day work of the Electrical, Signal and Power Integrity and CAD functional groups
· Identifies and Maintains technical leaders within the functional groups to assist with technical guidance of the functional groups and overall engineering team
· Executes strategic initiatives and assigns responsibilities with the functional groups as per the Microsystems leadership and Annual Operating Plan
· Works with direct reports to identify strengths and development needs, on-going progress discussions for career development
· Develops team talent, which includes regular feedback and coaching on their development experiences, attracts and retains Talent that contributes to the growth and revenue of Microsystems Business Unit.
· Holds self and team members accountable for their quality results, on-time delivery and BU objectives and their goals
· Aligns and motivates team around Microsystems purpose, culture, values, drives focus on prioritized goals and clarity of roles, responsibilities and processess.
· Builds open, trusting, and respectful relationships across the engineering team.
· Works closely with Technical Project Managers to support project executions
· Address problems directly, makes rapid course corrections and drives necessary changes to achieve business objectives.
· Drives professional and respectful collaboration within the functional groups and across the engineering team and overall for the Microsystems Business Unit
· Manage relationships with current vendors and subcontractors to ensure they remain on budget and provide quality on-time results and work to identify other vendors and subcontractors as necessary to provide the best solutions for our products
Required Qualification:
· Minimum of 3 years of recent experience leading engineering teams.
· Minimum of 10 years in the Electrical Engineering domain
· Minimum Education: Bachelor’s Degree in Electrical Engineering or relevant discipline
· Technically manage projects or processes
· Work effectively individually and as part of a team with little oversight
· Coach, review and delegate work to other professionals
· Influence others regarding policies, practices and procedures
· Excellent listening, written and verbal communication, tolerance of ambiguity, and commitment to tasks.
· Embrace the company culture that include the following values and behaviors:
· Teamwork, execution, communication, integrity, trust, customer focus, commitment, and sense of urgency
· Experience with continuous improvement and lean engineering principles
· Delivering results, innovation, helping and caring for others, recognizing and rewarding success, and life-long learning
Preferred Qualification:
· Package design of 3D devices, Heterogeneous integration, System in Package (SiP) design and assembly, interposer or substrate design,
· Toolset experience using
· ANSYS: HFSS, Electronics Desktop, Siwave, Q3D
· Cadence: Virtuoso, SiP, Concept, Orbit IO, Allegro / APD, and Engineering Data Management (EDM)
· Mentor Valydate
· Keysight ADS
· Atlassian Suite (Jama, Jira, Confluence, etc.)
· Lab equipment (o-scopes, logic analyzer, power supplies, etc.)
“This position requires you to have or obtain a government security clearance. Security clearances may only be granted to U.S. citizens.”
Electrical Engineering Manager
Phoenix, AZ 85034 US
Posted: 06/08/2023
2023-06-08
2023-07-09
Employment Type:
Perm
Industry: Engineering
Job Number: 240608
Job Description
Job Description:
· Directs Microsystem Electrical Team day-to-day work of the Electrical, Signal and Power Integrity and CAD functional groups
· Identifies and Maintains technical leaders within the functional groups to assist with technical guidance of the functional groups and overall engineering team
· Executes strategic initiatives and assigns responsibilities with the functional groups as per the Microsystems leadership and Annual Operating Plan
· Works with direct reports to identify strengths and development needs, on-going progress discussions for career development
· Develops team talent, which includes regular feedback and coaching on their development experiences, attracts and retains Talent that contributes to the growth and revenue of Microsystems Business Unit.
· Holds self and team members accountable for their quality results, on-time delivery and BU objectives and their goals
· Aligns and motivates team around Microsystems purpose, culture, values, drives focus on prioritized goals and clarity of roles, responsibilities and processess.
· Builds open, trusting, and respectful relationships across the engineering team.
· Works closely with Technical Project Managers to support project executions
· Address problems directly, makes rapid course corrections and drives necessary changes to achieve business objectives.
· Drives professional and respectful collaboration within the functional groups and across the engineering team and overall for the Microsystems Business Unit
· Manage relationships with current vendors and subcontractors to ensure they remain on budget and provide quality on-time results and work to identify other vendors and subcontractors as necessary to provide the best solutions for our products
Required Qualification:
· Minimum of 3 years of recent experience leading engineering teams.
· Minimum of 10 years in the Electrical Engineering domain
· Minimum Education: Bachelor’s Degree in Electrical Engineering or relevant discipline
· Technically manage projects or processes
· Work effectively individually and as part of a team with little oversight
· Coach, review and delegate work to other professionals
· Influence others regarding policies, practices and procedures
· Excellent listening, written and verbal communication, tolerance of ambiguity, and commitment to tasks.
· Embrace the company culture that include the following values and behaviors:
· Teamwork, execution, communication, integrity, trust, customer focus, commitment, and sense of urgency
· Experience with continuous improvement and lean engineering principles
· Delivering results, innovation, helping and caring for others, recognizing and rewarding success, and life-long learning
Preferred Qualification:
· Package design of 3D devices, Heterogeneous integration, System in Package (SiP) design and assembly, interposer or substrate design,
· Toolset experience using
· ANSYS: HFSS, Electronics Desktop, Siwave, Q3D
· Cadence: Virtuoso, SiP, Concept, Orbit IO, Allegro / APD, and Engineering Data Management (EDM)
· Mentor Valydate
· Keysight ADS
· Atlassian Suite (Jama, Jira, Confluence, etc.)
· Lab equipment (o-scopes, logic analyzer, power supplies, etc.)
“This position requires you to have or obtain a government security clearance. Security clearances may only be granted to U.S. citizens.”